Polycrystalline diamond:
It is formed by sintering micron-sized diamond particles and silicon as a binder under high temperature and high pressure conditions (sintered diamond), which is resistant to high temperature of 950°. It has excellent wear resistance, stability and uniform particle size, which is conducive to processing. It is suitable for drawing copper wire, welding wire, iron wire, stainless steel wire, molybdenum wire and other wire rods and pipes.